High precision stainless steel universal BGA reballing stencil for CPU, eMMC, NAND, PMIC, and IC chip solder ball rework. Suitable for iPhone, Android, and PCB repair applications.
High precision stainless steel universal BGA reballing stencil for CPU, eMMC, NAND, PMIC, and IC chip solder ball rework. Suitable for iPhone, Android, and PCB repair applications.